Single crystal silicon wafer Intrinsic (2-inch)

Product Name: Single crystal silicon wafer Intrinsic (2-inch)

Provided in a Single wafer case:

Description:

Single crystal silicon wafer Intrinsic (2-inch) is the most widely used semiconductor material as a substrate material due to its excellent machinability, mechanical stability, and the potential to combine sensing elements and electronics on the same substrate. Circular wafers made of silicon are used as a substrate in most MEMS sensors.

The crystal orientation should be known before manufacturing since silicon has orientation-dependent properties such as piezoresistivity coefficients and etching rates. The common orientation is (100) where the numbers represent Miller indices.

As an example, (100) wafer that has a primary flat side as an indication of < 110 > direction. When a piezoresistive element is placed on a (100) wafer, the orientation should be parallel to < 110 > direction if the piezoresistivity coefficients in that direction are intended to be utilized.

Please email us for the customization.

Email: contact@nanochemazone.com

Please contact us for customization and price inquiry

Note: We supply different size ranges of Nano and micron as per the client’s requirements and also accept customization in the various parameters.

Single Crystal Silicon Wafer Diameter Intrinsic (4-inch)

Product Name: Single Crystal Silicon Wafer Diameter Intrinsic (4-inch)

Provided in Single wafer case.

Description:

Single Crystal Silicon Wafer thickness Is determined by the mechanical strength of the material used the wafer must be thick enough to support its own weight without cracking during handling. Wafers are grown from crystal having a regular crystal structure, with silicon having a diamond cubic structure. Orientation is defined by the Miller index with (100) or (111) faces being the most common for silicon. Ion implantation depends on the wafer’s crystal orientation since each direction offers distinct paths the transport.

Note: SSP = Single Side Polished, DSP = Double Side Polished, E = Etched, C = AsCut, Material – CZ unless noted, L = Lapped, Und = Undoped (Intrinsic)