| Product Name |
Silver Conductor Paste for Thick Film Circuits
|
| CAS No. |
7440-22-4 |
| Appearance |
Powder |
| Purity |
≥99.9% |
| Fineness |
1-15µM (Can be customized) |
| Ingredient |
Ag |
| Product Code |
NCZ-24AV-154 |
Thick film conductive paste generally consists of three main components: functional phase, bonding phase and organic carrier. The functional phase determines the conductivity of the slurry and affects the physical and mechanical properties of the film. In conductive pastes, the functional phases are generally metals, alloys or mixtures thereof. The role of the bonding phase is to make the film and matrix firmly combined, usually glass, oxide crystal or their mixture as the bonding phase, the choice of bonding phase has a certain effect on the mechanical and electrical properties of the film. Organic carrier is a solution formed by polymer dissolved in organic solvent. It is the carrier of functional phase and bonded phase particles. It can control the rheological properties of slurry and make it suitable for screen printing.
The properties of thick film conductive paste vary according to different applications, usually including adhesion strength, weldability (wettability); In addition, the paste is required to have good technology, such as thixotropy, printing reproducibility and sintering. The composition of slurry, the ratio of each phase and the preparation method of slurry are the key factors to determine the above properties.
Product Parameters
| Silver conductor paste for thick film circuits |
Name |
Sheet Resistance（mΩ/□） |
Fineness
（μm） |
Weldability |
Adhesion
（N/2×2mm） |
| NCZ-Ag5310 |
＜5 |
≤10 |
Excellent |
＞30 |
|
| NCZ-Ag-5510 |
＜5 |
≤10 |
Excellent |
＞50 |
|
Product Parameters
Customized according to customer requirements
Product Feature
*Lead-free,chromium-free,mercury-free,RoHS compliant.
*Excellent printability,conductivity and adhesion strength.
*Good weather resistance and chemical stability.
*The resistance value can be adjusted arbitrarily with the same series of silver pastes.
Application
It is suitable for thick film hybrid integrated circuit, lead and electrode of separated components, internal connection and end lead of circuit made by medium temperature firing, electrode of semiconductor ceramic devices, Environmental protection paste, special circuit on the AL2O3 ceramic substrate internal connection and end lead wire, ceramic device electrode, etc
Silver Conductor Paste for Thick Film Circuits Properties /Description
Silver Conductor Paste for Thick Film Circuits is generally immediately available in most volumes. Nanochemazone produces many standard grades when applicable, including Mil Spec (military grade); ACS, Reagent and Technical Grade; Food, Agricultural, and Pharmaceutical Grade; Optical Grade, USP and EP/BP (European Pharmacopoeia/British Pharmacopoeia) and follows applicable ASTM testing standards. Typical and custom packaging is available. Additional technical, research, and safety (MSDS) information are available, as is a Reference Calculator for converting relevant units of measurement.
Related Information:
Storage Conditions:
Airtight sealed, avoid light, and keep dry at room temperature.
Please get in touch with us for customization and price inquiry
Email: contact@nanochemazone.com
Note: We supply different size ranges of Nano and micron as per the client’s requirements and accept customization in various parameters.
