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Copper Nanoparticles Dispersion

MF: Cu
Chemical Name:

Copper Nanoparticles Dispersion

Purity: >99.99%
APS: 50 nm (Size Customization possible)
Form: Nano dispersion
Product Number: NCZD401
CAS Number 7440-22-4

Copper Nanoparticles Dispersion Applications:

The key applications of copper nanoparticles are listed below:

Copper nanoparticles based ink for screen printed circuits and electrode fabrication for electrochemistry. 

Acts as an anti-biotic, anti-microbial, and anti-fungal agent when added to plastics, coatings, and textiles. Copper diet supplements with efficient delivery characteristics. High strength metals and alloys.

Copper plays an important role in electronic circuits because of its excellent electrical conductivity and ideal material for Thermal, electronic, and biomedical applications such as antimicrobial, Dental Health care and antiviral mask, and gloves coating. 

Copper Nanoparticles Dispersion Related Information

Storage Conditions:

Airtight sealed, avoid light and keep dry at room temperature.

Please contact us for customization and price inquiry

Email: contact@nanochemazone.com

Note: We supply different size ranges of Nano and micron as per the client’s requirements and also accept customization in various parameters.

Description

Note: For pricing & ordering information, please contact us at sales@nanochemazone.com
Please contact us for quotes on Larger Quantities and customization. E-mail: contact@nanochemazone.com

Customization:

If you are planning to order large quantities for your industrial and academic needs, please note that customization of parameters (such as size, length, purity, functionalities, etc.) is available upon request.

NOTE:

Images, pictures, colors, particle sizes, purity, packing, descriptions, and specifications for the real and actual goods may differ. These are only used on the website for the purposes of reference, advertising, and portrayal. Please contact us via email at sales@nanochemazone.com or by phone at (365) 888-7013 if you have any questions.

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Copper Nanoparticles Dispersion
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